LUXEON Flip ChipPhilips Lumileds LUXEON® Flip Chip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level and customize the phosphor and packaging to best suit their lighting applications.
LUXEON Flip Chip is a real Chip Scale Package LED that can be attached by reflow without additional packaging. Traditional wire bonding limits the packing and power density of LEDs. LUXEON Flip Chip LEDs can be packaged closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen output at higher lumen densities.
Features & Benefits
- High drive current up to 1A/mm2
- 1.0 mm x 1.0 mm 5-side emitter
- 440-460 nm wavelength
- High current density for high lumen and lm/$, at high lm/W
- High-packaging density
- Surface mount capable, no wire bonds