LUXEON Thermal Management Capabilities
A key element in delivering quality high-power LEDs is managing the heat emitted from the LED chip. Advanced packaging technology provides LUXEON® power LEDs with unique thermal management capabilities. Using a thermal heatsink slug for the LED chip, heat is pulled away from the chip and can be transferred to a thermal management system. Because of the unique thermal design features and capabilities, LUXEON® LEDs can withstand the industry’s highest junction temperatures allowing for increased light output performance. For more information about the thermal capabilities of LUXEON® LEDs, please consult our application briefs and datasheets in our documentation center.Typical construction of a 5mm LED
(little or no LED thermal management)
(little or no LED thermal management)
LUXEON® Rebel Power LED Cross Section
(Thermal pad extracts heat from the LED chip)
